Hi Marten, I looked at your original post, and see that there is a 10uH inductor between AGND and BDGND. All of the ABS MAX specifications assume that AGND and BDGND are connected together using a low impedance ground near the device. If these grounds are moving more than a few hundred mV's with respect to each other during a transient, this may cause a latch-up condition as well. Figure 2, page 10, for the ADS8406 EVM User's guide shows how the grounding was done for the evaluation board. http://www.ti.com/lit/ug/slau126a/slau126a.pdf Please make sure that the AGND and BDGND pins are connected together through a low impedance path near the device. Regards, Keith N.
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