Hello, We don't have recommendations per say, we can share what we have done in the past, or general best practices. I would recommend asking a PCB manufacturer. 1. and 2. It is best practice to come out straight from the pad and not run under the device. Although there is no exposed traces under the device, there is a large thermal pad, thus running a risk to shorting a trace to the thermal is present. 3. This varies and we do not have the expertise or recommandation between either. I did find ths following article from a PCB manufacturer that can prove helpful: Comparison between ENIG and ENEPIG 4. We commonly use LPI for our boards. 5. The device should be flat, thus the thermal pad and the pins should lay flat on the board. There should be no concavities. I also found this power point by a chemical company that speaks to the board finish and relates them to sectors. Regards Cynthia
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