Hello Manuel, Thank you for the picture. This is not oxidation, but mold compound that 'leaked' into the perimeter of the thermal pad. This is a normal assembly variation that can occur during packaging of the IC. Assuming the other devices have similar mold leakage into the perimeter of the thermal pad, this will not cause any functional issues, or soldering issues, with the devices. The customer should not have any concerns using these parts. Please let me know if there are any other questions or concerns. Regards, Keith
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